Description

Description

  • 5G DONGLE Module, 4 Antennas, USB3.1 Port, Aluminum Alloy Heatsink by Waveshare
  • M.2 Key B
  • Comes with a customized aluminum alloy heatsink
  • Features four SMA antenna connectors
  • Provides good heat dissipation
  • Onboard SIM card slot
  • Support SIMCom and Quectel 5G module

The Waveshare 5G DONGLE Module, 4 Antennas, USB3.1 Port, Aluminum Alloy Heatsink comes with a customized aluminum alloy heatsink, good heat dissipation, nice-looking, protective, and durable. Onboard power and network indicators, with multiple reserved pads, for checking module operating status and testing other functions.

Support 5G modules with M.2 (NGFF) Key B interface, compatible with SIMCom and Quectel 5G modules. Features USB 3.1 Type-A port for connecting to PC, Raspberry Pi, or Jetson Nano host board to enable high-speed 5G network. PCB ENIG process reserved multi slots and positioning holes for integration.

  • 1x USB TO M.2 B KEY
  • 1x Aluminum Alloy Case (top and bottom)
  • 4x Antenna
  • 4x IPEX Adapter Cable
  • 1x USB Type-A Extension Cable
  • 4x SMA Protective Cap
  • 1x Thermal Tape
  • 1x Screw Pack

Size

  • 75 x 30.1 x 20.8 mm (L x W x H)
  • Antenna Height: 128.8 mm

  • Antenna: 4
  • IPEX adapter cable: 4
  • Heatsink Material: Aluminum alloy
  • USB Type-A extension cable: Included
  • SMA Protective Cap: 4
  • Thermal tape: Included
  • SIM card slot: Included
  • Power and network indicators: Yes
  • Weight: 157 g
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